1437522-8
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1437522-8 datasheet
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Маркировка1437522-8
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ПроизводительTE Connectivity
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ОписаниеTE Connectivity 1437522-8 Application: Production Assembly Process Feature: None Chip Compatibility: Any Socket 7 Chip, Cyrix, Intel?® Pentium?® Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (10) Contact Style: Stamped + Formed Frame Style: Open Grid Size: 19x19 Grid Spacing (mm [in]): Interstitial: 1.27 x 2.54 [.050 x .100] Heat Sink Attachment: With Heat Sink Style: Universal Housing Material: Thermoplastic - GF Insertion Force: Low Lead Free Solder Processes: Wave solder capable to 240?°C Number Of Positions: 321 Packaging Method: Tube Pcb Mount Style: Through Hole Profile: Low Rohs/elv Compliance: Not ELV/RoHS compliant Sleeve Material: Copper Alloy Socket Identifier: None Socket Overall Height (mm [in]): 4.57 [0.18] Termination Post Length (mm [in]): 2.29 [0.090] Ul Flammability Rating: UL 94V-0
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Количество страниц1 шт.
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Форматы файлаHTML, PDF
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